各大行业职位任你选
首次验证通过即注册BOSS直聘账号职位描述
- 半导体封装
1. Understand the semiconductor market and translate market requirements to packaging effectively. Responsible for the design, development, execution, and implementation of packaging product, structures, or assembly process technologies.
2. Address and solve materials and processing issues that may occur during the development process.
3. Develop solutions by working closely with Package Innovation teams including Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing.
4. Familiar with project management by using industry standard project management tools.
5. Collaborate with NXP internal assembly sites and OSATs to qualify product package solutions.
6. Investigate the feasibility of emerging technologies and capabilities to potential semiconductor packaging and assembly process. Then, effectively develop or design the implementation of these into manufacturing.
7. Maintain substantial knowledge of state-of-the-art principles and theories and may contribute to scientific literature and conferences.
8. May also participate in development of patent applications.
9. May involve international travel to package assembly sites and NXP suppliers.
Job Qualifications:
1. M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering or Electrical Engineering
2. Minimum 3-5 years of experience in Semiconductor Packaging development role
3. Working knowledge of various IC packages like QFP, QFN, BGA, FCBGA, FCCSP, WLCSP and FOWLP is required.
4. Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
5. Knowledge of Statistical Analysis and Design of Experiment is a plus.
6. Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.
张女士 今日活跃
竞争力分析
BOSS 安全提示
BOSS直聘严禁用人单位和招聘者用户做出任何损害求职者合法权益的违法违规行为,包括但不限于扣押求职者证件、收取求职者财物、向求职者集资、让求职者入股、诱导求职者异地入职、异地参加培训、违法违规使用求职者简历等,您一旦发现此类行为, 请立即举报
了解更多职场安全防范知识公司介绍
恩智浦2010年在美国纳斯达克上市2015年,恩智浦收购了由摩托罗拉创立的飞思卡尔半导体,成为全球前十大非存储类半导体公司,以及全球最大的汽车半导体供应商(Strategy Analytics)。
在全球30个国家和地区设有办事处,总员工人数超30000,2021年全球营收为110.63亿美元。
工商信息
- 公司名称恩智浦半导体(天津)有限公司
- 法定代表人张虎昌
- 成立日期2004-04-14
- 企业类型有限责任公司(港澳台法人独资)
- 经营状态存续
- 注册资金33400万美元
工作地址
点击查看地图
精选职位
更新于:2024-06-05