职位描述
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Technical Director, Wafer Foundry & Assembly & Testing Engineering
The individual in this leadership position is expected to fulfill a broad range of responsibilities related to wafer technology definition, on-boarding and sustaining, assembly & testing resources. Additional responsibility includes mentoring a small group of production & testing.
Responsibilities:
1.Collaborate with design leads to understand gaps in existing wafer technology portfolio.
2.Identify solutions that meet Performance, Quality, Cost and Capacity constraints.
3.Roll-out new technologies by working with design enablement, Quality and Reliability, Product Engineering
4.Collaborate with Supplier and Customer quality to address customer issues
5.Identify and execute cost reduction initiatives
6.Mentor a group of technologists with expertise in CMOS, Advanced packaging, FPGA or digital logic products etc.
Experience and Skills:
·Bachelor’s degree (or higher) in Electrical Engineering, Material Science, Physics, Chemical Engineering or pertinent disciplines.
·10+ years in Semiconductor industry; hands-on experience in package design (ballmap &pinlist…) is highly desirable
·Experience in working with wafer foundries or assemblies.
·Strong analytical skills
·Strong organizational & executive skills
·Detailed-oriented
·Ability to communicate to a variety of audiences, including executive management
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更新于:2024-06-07